DNQ building blocks for g-line and i-line positive photoresists.
From the 2-1-4 sodium salt and DNQ-THBP ester building blocks to Orion P-1403, P-1610, P-3101 and P-0711 grades for spin-coated wafer photoresists.
The core water-soluble DNQ salt — a main building block for DNQ-based coating solutions used to manufacture electronic photoresists and converted into sulphonyl chloride for further esterification.
DNQ-THBP is the industry-standard photoactive compound (PAC) for positive-tone g-line (436 nm) and i-line (365 nm) microlithography. Novolak resin acts as the base matrix; THBP esterified with DNQ functions as the PAC. Orion supplies this building block alongside Orion P-1403, P-1610, P-3101 and P-0711 grades.
Orion P-1403 is a yellow to yellow-brown DNQ-THBP building block supplied as dry powder. Blend with your choice of cresol novolak resin at 3.0–3.5 parts resin to one part P-1403 for spin-coated g-line or i-line positive photoresists.
Orion P-3101 is a ready-to-use 20% solids DNQ-THBP coating solution for g-line and i-line positive photoresists. Solvents and resin are pre-selected — spin-coat directly without in-house dissolution.
Orion P-1610 is a yellow to yellow-brown DNQ-THBP building block supplied as dry powder with a matched novolak resin. Optimised for i-line dominance with sharper contrast and higher resolution than P-1403 alone.
Orion P-0711 is a DNQ-THBP cresol novolac resin (CNR) photoactive compound for positive-tone g-line (436 nm), i-line (365 nm) and advanced i-line imaging on silicon wafers. The THBP core is esterified with DNQ groups and paired with an m-/p-cresol formaldehyde novolac matrix for submicron resolution and high thermal stability.
We supply DNQ actives and coating systems to printing-plate manufacturers, photoresist makers and trade buyers. Tell us your process and target and we'll match a grade.