Orion P-0711 — DNQ-THBP-CNR Photo Active Compound
Orion P-0711 is a DNQ-THBP cresol novolac resin (CNR) photoactive compound for positive-tone g-line (436 nm), i-line (365 nm) and advanced i-line imaging on silicon wafers. The THBP core is esterified with DNQ groups and paired with an m-/p-cresol formaldehyde novolac matrix for submicron resolution and high thermal stability.
Built for consistent qualification into your process.
Where Orion P-0711 is used.
Semiconductor IC manufacturing
Positive-tone patterning for logic, memory and discrete devices on g-line and i-line steppers. Electronic photoresist applications.
MEMS, sensors & optoelectronics
Thick-film photoresist applications (up to 5–10 μm) for insulation, passivation or electroplating molds, with reliable step coverage over topography. DNQ-THBP building block overview.
Packaging, storage and how to order.
Orion P-0711 is supplied as dry powder or ready solutions for g-line, i-line and advanced i-line positive photoresist programmes on silicon wafers.
Request a quote or sample of Orion P-0711.
Tell us your plate system, coating line or photoresist process and we'll confirm the right grade, pack size and documentation.